Photonics Research Group Home
Ghent University Journals/Proceedings
About People Research Publications Education Services
 IMEC
intern

 

Publication detail

Authors: G. Jo, P. Edinger, S. Bleiker, X. Wang, A.Y.Takabayashi, H. Sattari, N. Quack, M. Jezzini, P. Verheyen, G. Stemme, W. Bogaerts, K.B. Gylfason, F. Niklaus
Title: Wafer-level vacuum sealing for packaging of silicon photonic MEMS
Format: International Conference Proceedings
Publication date: 3/2021
Journal/Conference/Book: SPIE Photonics West OPTO
Volume(Issue): 11691 p.116910E
DOI: 10.1117/12.2582975
Citations: 9 (Dimensions.ai - last update: 29/9/2024)
7 (OpenCitations - last update: 27/6/2024)
Look up on Google Scholar
Download: Download this Publication (906KB) (906KB)

Abstract

We demonstrate the first wafer-level hermetic vacuum packaging of Si photonic MEMS with optical and electrical feedthroughs. Si photonic MEMS is emerging as a unique technology for large-scale reconfigurable photonics. Hermetic vacuum packaging is critical to the performance and longevity, and to protect from contamination. However, there are no existing wafer-level packaging methods that

provide hermetic vacuum packaging with optical and electrical feedthroughs for Si photonic MEMS. The packaging method consists of sealing the photonic devices with 25 µm-thin Si caps. We illustrate the effectiveness of our solution by packaging wafers produced in the iSiPP50G Si photonics platform of IMEC.

Related Research Topics

Related Projects

Citations (OpenCitations)

Back to publication list