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Authors: Z. Wang, A. Abbasi, U.D. Dave, A. De Groote, S. Kumari, B. Kunert, C. Merckling , M. Pantouvaki, Y. Shi, B. Tian, K. Van Gasse, J. Verbist, R. Wang, W. Xie, J. Zhang, Y. Zhu, J. Bauwelinck, X. Yin, Z. Hens, J. Van Campenhout, B. Kuyken, R. Baets, G. Morthier, D. Van Thourhout, G. Roelkens
Title: Novel light source integration approaches for silicon photonics
Format: International Journal
Publication date: 7/2017
Journal/Conference/Book: Laser & Photonics Reviews
Editor/Publisher: Wiley-VCH, 
Volume(Issue): 11(4) p.1700063 (21 pages)
DOI: 10.1002/lpor.201700063
Citations: 154 ( - last update: 26/5/2024)
42 (OpenCitations - last update: 19/4/2024)
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Silicon does not emit light efficiently, therefore the integration of other light-emitting materials is highly demanded for silicon photonic circuits. A number of integration approaches have been extensitvely explored in the past few years. Here, we review the most recent progress of this field, covering the integration approaches of III-V-to-silicon bonding, transfer printing, epitaxial growth and the use of colloidal quantum dots. The basics of the way to create various on-chip light sources for different application scenarios will be discussed, as well as some recent representitive device demonstrations, including high speed DFB lasers, ultra-dense comb lasers, short (850nm) and long (2.3um) wavelength lasers, wide-band LEDs, monolithic O-band lasers and disk lasers operating in the visible. The challenges and opportunities of these approaches are also discussed.

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