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Authors: L. Zimmermann, T. Tekin, H. Schröder, P. Dumon, W. Bogaerts
Title: ePIXpack - Advanced Smart Packaging Solutions for Silicon Photonics
Format: International Conference Proceedings
Publication date: 6/2008
Journal/Conference/Book: European Conference on Integated Optics (ECIO 2008)
Volume(Issue): p.WeB2
Location: Eindhoven, Netherlands
Citations: Look up on Google Scholar
Download: Download this Publication (2.1MB) (2.1MB)


We introduce two Silicon photonics packages to be used in future applications requiring multiple optical & electrical i/o. One package is based on a fiber array to assure small footprints. The other package provides configurable optical & electrical connectivity. Both packages are built using commercially available parts.

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