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Quantera: uTP4Q

Full Name: A versatile quantum photonic IC platform enabled by micro-transfer printing

Duration: 1/5/2022-2/3/2025


  • Dries Van Thourhout, Dries Van Thourhout (Ghent University, BE)
  • Wolfram Pernice (Heidelberg University, DE)
  • Leonardo Midolo (University of Copenhagen, DK)
  • Niels Hersoug (Sparrow Quantum, DK)
  • Janez Krc (Univerza v Ljubljani , SI)
  • Michel Despont, Amir Ghadimi (Swiss Centre for Electronics and Microtechnology, CH)


  • We will demonstrate the benefits of heterogeneous integration of different materials by combining InAs quantum dot emitters, Lithium Niobate modulators and switches, and superconducting detectors on a mature foundry-based silicon nitride waveguide interposer. To achieve such seamless integration between various well-established architectures, it is necessary to develop a robust and industry-ready baseline for cross-platform integration.
  • uTP4Q will employ micro-transfer printing as the key technological framework for combining multiple functional technologies for quantum optical processing on a Silicon Nitride waveguide interposer. This is where uTP4Q is ground-breaking: for the first time we will integrate several building blocks of different nature on a single SiN waveguide interposer.

INTEC's Role:

  • Project Coordinator
  • Design, development and execution of microtransfer printing process

Project Web site:

People involved

Publications in the framework of this project (1)

        International Conferences

      1. I. Luntadila Lufungula, B. Kuyken, Non-reciprocal transmission in ring resonators with saturable absorption, Annual Symposium of the IEEE Photonics Society Benelux Chapter 2022, Netherlands, (2022)  Download this Publication (310KB).