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Dr. Biwei Pan  (Postdoctoral Researcher)

This person is working in this group since 2021.
Affiliation: Ghent University - IMEC
Information Technology (INTEC)
Address: Technologiepark-Zwijnaarde 126
9052 Ghent
Belgium
Office: iGent, Office 150.032
Phone: +32 09 331 48 25
E-mail: Biwei.Pan@ugent.be
ORCID: 0000-0002-9831-2808
Research Area: heterogeneous integration
Promotor: Gunther Roelkens
BiweiPan
Biwei Pan received a Ph.D. degree in Microelectronics and Solid State Electronics from Institute of Semiconductors, Chinese Academy of Sciences in 2016. From 2017 till 2021, he worked at Huawei as a senior design engineer of photonic integrated chips. Now, he hold a postdoctoral position at UGent-IMEC, where his research is focused on heterogeneous integration of III-V semiconductors with silicon waveguide circuits.

Specific Research Topics

Publications (12)

    International Journals

  1. B. Pan, J. Bourderionnet, V. Billault, G. Dande, M. Dahlem, J. Song, S. Dwivedi, D. Altamirano, C. Cummins, S. Saseendran, P. Helin, J. Ramirez, D. Neel, E. Soltanian, J. Zhang, G. Roelkens, III-V-on-Si3N4 widely tunable narrow-linewidth laser based on micro-transfer printing, Photonics Research, 11(12), p.2508-2520 doi:10.1364/PRJ.530925 (2024)  Download this Publication (2.8MB).
  2. G. Dande, J. Pennanech, C. Charliac, V. Kemlin, V. Crozatier, I. Ghorbel, Vi.BILLAULT, B. Pan, E. Soltanian, J. Zhang, G. Roelkens, M. Dahlem, J. Song, S. Dwivedi, D. Altamirano, C. Cummins, J. Ramirez, D. Neel, J. Bourderionnet, Narrow linewidth III-V-on-SiN laser with extended frequency chirp capability based on micro-transfer printing for high resolution distributed acoustic sensing, Optics Express, doi:10.1364/OE.529238 (2024).
  3. G. Roelkens, J. Zhang, L. Bogaert, E. Soltanian, M. Billet, A. Uzun, B. Pan, Y. Liu, E. Delli, D. Wang, V. Bonito Oliva, L.Thi Ngoc Tran, X. Guo, H. Li, S. Qin, K. Akritidis, Y. Chen, Y. Xue, M. Niels, D. Maes, M. Kiewiet, T. Reep, T. Vanackere, T. Vandekerckhove, I. Luntadila Lufungula, J. De Witte, L. Reis, S. Poelman, Y. Tan, H. Deng, W. Bogaerts, G. Morthier, D. Van Thourhout, B. Kuyken, Present and future of micro-transfer printing for heterogeneous photonic integrated circuits, Applied Physics Letters - Photonics (invited), doi:10.1063/5.0181099 (2024)  Download this Publication (1.4MB).
  4. G. Roelkens, J. Zhang, L. Bogaert, M. Billet, D. Wang, B. Pan, C.J. Krückel, E. Soltanian, D. Maes, T. Vanackere, T. Vandekerckhove, S. Cuyvers, J. De Witte, I. Luntadila Lufungula, X. Guo, H. Li, S. Qin, G. Muliuk, S. Uvin, B. Haq, C. Op de Beeck, J. Goyvaerts, G. Lepage, P. Verheyen, J. Van Campenhout, G. Morthier, B. Kuyken, D. Van Thourhout, R. Baets, Micro-transfer printing for heterogeneous Si photonic integrated circuits, IEEE Journal on Selected Topics in Quantum Electronics (invited), 29(3), p.8200414 doi:10.1109/JSTQE.2022.3222686 (2022)  Download this Publication (6.4MB).
      International Conferences

    1. H. Li, T. Pannier, Y. Gu, R. Loi, P. Ramaswamy, P. Steglich, B. Pan, J. Zhang, P. Ossieur, G. Roelkens, Electronic-Photonic Integrated Circuits through Micro-Transfer Printing, accepted for publication in IEEE Silicon Photonics Conference 2025,  (to be published).
    2. B. Pan, G. Roelkens, Micro-transfer Printing of Pre-fabricated III-V Chiplets on Silicon and Silicon Nitride PICs, 2024 Asia Communications and Photonics Conference (ACP) (invited), (2024).
    3. H. Li, B. Pan, J. Zhang, T. Pannier, L. Bogaert, P. Ossieur, G. Roelkens, Heterogeneous integration of low voltage III-V electro-absorption modulator and driver for optical I/O by micro-transfer printing, IEEE Photonics Benelux Annual Symposium 2024, Netherlands, (2024).
    4. B. Pan, J. Bourderionnet, V. Billault, D. Guenole, M. Dahlem, D.C. Altamirano, C. Cummins, S.S. Saseendran, P. Helin, J. Ramirez, D. Neel, E. Soltanian, J. Zhang, G. Roelkens, Experimental Demonstration of A Micro-Transfer Printed InP-On-Si3N4 Widely Tunable Laser, IEEE 29th International Semiconductor Laser Conference (ISLC) 2024, United States, p.paper WA6 (2 pages) doi:10.1109/ISLC57752.2024.10717379 (2024)  Download this Publication (446KB).
    5. B. Pan, P. Voorthuijzen, D. Altamirano, C. Cummins, S. Saseendran, P. Helin, M. Dahlem, J. Zhang, G. Roelkens, Simulation and Experimental Demonstration of a Tolerant and Low-loss III-V-to-Si3N4 Adiabatic Coupling Structure, IEEE Opto-Electronics and Communications Conference (OECC) 2024, (2024).
    6. J. Zhang, L. Bogaert, M. Billet, D. Wang, B. Pan, S. Qin, E. Soltanian, S. Cuyvers, D. Maes, T. Vanackere, T. Vandekerckhove, S. Poelman, M. Kiewiet, I. Luntadila Lufungula, X. Guo, H. Li, J. De Witte, G. Lepage, P. Verheyen, J. Van Campenhout, B. Kuyken, G. Morthier, D. Van Thourhout, R. Baets, G. Roelkens, Photonic integrated circuits realized using micro-transfer printing, PIERS (invited), (2023).
    7. C. Cummins, B. Pan, G. Roelkens, M. Dahlem, S. Saseendran, P. Helin, Material characterisation of LPCVD SiN and understanding loss behavior, Conference on Lasers and Electro-Optics Europe, p.16 (2023)  Download this Publication (443KB).
    8. B. Pan, Jerome Bourderionnet, Vincent Billault, Arnaud Brignon, S. Dwivedi, Marcus Dahlem, Cian Cummins, Sandeep S. Saseendran, Nga Pham, Philippe Helin, Nicolas Vaissiere, Delphine Neel, Joan Ramirez, Jean Decobert, Johanna Rimbock, Ruggero Loi, Alin Fecioru, E. Soltanian, J. Zhang, B. Kuyken, G. Roelkens, III-V-on-silicon nitride narrow-linewidth tunable laser based on micro-transfer printing, Optical Fiber Communication Conference, Th3B.5, United States, p.paper Th3B.5 (3 pages) doi:10.1364/OFC.2023.Th3B.5 (2023)  Download this Publication (493KB).
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